Course Overview

Science of Soldering© Curriculum

A comprehensive 4-part scientific journey from foundational chemistry and metallurgy to hands-on problem solving, complex component geometries, and automated assembly.

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Official Process Certification Included

All graduates receive Science of Soldering certification and presentation certificate, providing proof of advanced soldering science knowledge.

Designed for Every Level of Authority

You can't manage what you don't understand. By grounding soldering principles in chemistry and metallurgy rather than memorized rules, this curriculum bridges the gap between operator hand skills, process management, quality engineering, design, and operations oversight.

PART I

THE EDUCATION — DEVELOPING THE "RECIPE"

The class begins with what appears to be a simple exercise: soldering a wire to a turret terminal. However, the Exercise embodies the most common and serious causes of soldering defects encountered in every company every day — and the results are horrible. The class then transitions to the first step in problem solving: gathering knowledge.

Core Educational Modules:

1. The Core Science and Development of the Recipe

  • Wetting forces
  • Chemical reactions
  • Intermetallic bonds

2. Soldering vs. Welding (Reflow)

  • Why traditional “soldering” isn’t soldering
  • Why the difference matters
  • Uses of soldering and welding in electronics assembly

3. Clean Surfaces

  • Definition and importance
  • Contamination & oxide management

4. Flux

  • Types and characteristics
  • Acidity, ionic contamination & effects on reliability
  • The real definition of no–clean flux
  • “Neutral pH” fluxes
  • Selecting the ideal flux for high reliability

5. Solderability

  • Definition and importance
  • Solderability of component and PCB surfaces
  • Lead–free component finishes—the real lead-free issue
  • Scientific solderability management

6. Solder

  • Alloys (leaded and lead–free)
  • The myth that lead-free soldering is more difficult
  • Types of lead–free solders & reliability differences
  • Hidden traps in lead-free alloy selection
  • Mechanical properties (ductility and tensility)
  • Strategic evaluation: Should you go lead-free?

7. Heat

  • Why heat is needed and how much is required
  • Failure modes resulting from overheating
  • Scientific heat control and total elimination of damage during hand soldering

It's time to put all this knowledge to work and eliminate the Exercise's many defects.
(Part II: The Breakthrough)

PART II

THE BREAKTHROUGH

The Recipe has been presented but words are abstract. It's time to give the words substance by solving the Exercise. The Exercise contains many challenges, so eliminating all the defects takes many steps, experiments and demonstrations. Each iteration further clarifies the Recipe until, ultimately, perfect soldering of the Exercise is achieved – and it’s easy! How to apply the Recipe in the real world is clear. It's time for Part III, applying the Recipe to a broader range of components.

PART III

MORE EXPERIENCE

Although the Recipe is the core requirement for all soldering, components come in many sizes and shapes. Some of those configurations pose unique thermal problems. This section applies the Recipe to components very different from those of the Exercise and teaches the best ways to deal with each. They include through-hole components including heavy thermal mass PCBs and various surface mount components including fine pitch I.C.s.

PART IV

REPAIR

The most difficult challenge in repair is typically component removal. There are easy ways to replace most components without special tools. The class concludes with removal of components soldered in Part III.

On-Site Exclusive

Automated Machine Soldering & Shop Floor Implementation

Conducted directly on your active manufacturing floor. We work alongside your engineers and technicians to apply the 7-Step Recipe to your wave machines, selective tools, and SMT reflow ovens.

Wave & Selective Soldering

  • Applying the Recipe to wave machine setups & physical fluid dynamics.
  • Optimizing flux deposition and component design for wave producibility.
  • Role and management of turbulent (chip) waves.
  • Setting wave profiles for maximum first-pass yield.
  • Mini-wave, palletized, and dip selective soldering strategies.

SMT Reflow & Shop Floor Integration

  • Applying the Recipe to surface mount reflow ovens and stencil design.
  • Setting and managing oven profiles for maximum process robustness.
  • Hands-on line evaluations: reviewing chemistry, iron tips, and profile equipment.
  • Tailored consultation and defect elimination during live production runs.

Specialized Operations? Let’s Tailor Your Program

Additional technical topics and hands-on shop floor evaluations can be seamlessly integrated into your on-site event.

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